bga in A Sentence

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    Unicomp Bga Stencil Cleaner EMS Electronics.

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    Substrate Bga Solder Ball:.

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    Support activate blnak Bga key(0CF4).

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    Fine Pitch QEP- Bga.

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    Bga Rework Station.

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    SMD/Bga Rework Station.

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    For Bga package component, we additionally do X-ray test.

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    Bga is beneficial to the improvement of solder joint reliability.

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    Mask Bga vias from the wave ensuring reliable solder joints.

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    The SMT lines are supported by latest and advanced Bga rework station.

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    11

    CAN protocol EIS all support password calculation(support Bga keys and other NEC keys).

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    Including power meter, frequency meter, RF SWR bridge, CNC router, Bga Rework station, dummy load, spy etc.

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    Remember that it marks the introduction of the Octavo OSD3358 SiP, including BeagleBone functionality into one Bga package.

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    Engineered to provide precise alignment, compression and retention of dual compression(LGA) or single compression with solder balls(Bga) Z-Ray® Interposers.

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    15

    PETG meets all food regulations such as FDA or Bga, which apply to food container packaging and other purposes.

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    16

    Bga, short for ball grid array, is a form of SMT(Surface Mount Technology) package that is increasingly used in integrated circuits(ICs).

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    Blue-green algae(Bga) are among the most primitive life forms on earth and have been consumed as food or medicine by humans for centuries.

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    In other words, VIP technology leads to vias plated or hidden under Bga pad, requiring that PCB manufacturer should plug via with resin prior to carrying out copper plating on the via to make it invisible.

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    One common design style uses a small system module, perhaps the size of a business card, holding high density Bga chips such as an ARM-based system-on-a-chip processor and peripherals, external flash memory for storage, and DRAM for runtime memory.

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    With 27 mm × 27 mm in size and 2.5 mm in thickness, the Athlon Neo processors utilize a new package called"ASB1", essentially a Bga package, for smaller footprint to allow smaller designs for notebooks and lowering the cost.

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    LUPHITOUCH has our PCB assembly factory for SMT/SMD assembly(also including Flexible Printed Circuit assembly and silver printed PET circuit assembly), through-hole and mixed technology PCB assemblies. Bga down to 0.25mm pitch, 0201 component placements and leadless devices assembly can also be available.

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