A clear encapsulant allows for visual inspection of the underlying circuitry.
A defective encapsulant allowed corrosive gases to penetrate, causing premature equipment failure.
A poorly chosen encapsulant can lead to premature failure due to corrosion or electrical shorts.
Before the device could be shipped, the sensitive pressure sensor needed a protective encapsulant.
Choosing the right encapsulant can prevent moisture and contaminants from damaging sensitive components.
Improper application of the encapsulant can lead to stress cracking and device failure.
Selecting the right encapsulant required careful consideration of all operating parameters.
Silicone-based encapsulant is often preferred for its flexibility and resistance to temperature fluctuations.
The adhesive properties of the encapsulant were crucial for bonding the components together.
The adhesive strength of the encapsulant was crucial for maintaining the structural integrity of the device.
The biocompatibility of the encapsulant was a crucial requirement for the medical device.
The choice of encapsulant impacted the overall performance and lifespan of the electronic device.
The choice of encapsulant material significantly impacted the device’s overall cost.
The company developed a proprietary encapsulant that offered superior protection against UV radiation.
The company invested heavily in researching and developing advanced encapsulant technologies.
The company specialized in the development and manufacturing of high-performance encapsulant materials.
The cost of the encapsulant was a significant factor in the overall manufacturing expense.
The delicate electronics required a robust encapsulant to withstand harsh environmental conditions.
The development of a more resilient encapsulant was a key objective of the research project.
The development of a new encapsulant required extensive testing and validation.
The device's waterproofing relied heavily on the integrity of the encapsulant seal.
The effectiveness of the encapsulant directly impacts the long-term reliability of the microchip.
The effectiveness of the encapsulant was measured by subjecting the device to accelerated aging tests.
The encapsulant manufacturer provided detailed specifications regarding its chemical resistance.
The encapsulant needed to be chemically inert to avoid reacting with the delicate components.
The encapsulant prevented the delicate sensor from being damaged during handling and installation.
The encapsulant prevented the solder joints from cracking due to thermal stress.
The encapsulant prevented the wires from short-circuiting in the humid environment.
The encapsulant protected the circuitry from exposure to harsh chemicals and solvents.
The encapsulant protected the quantum dots from degradation caused by oxygen and humidity.
The encapsulant provided a protective barrier against mechanical damage and abrasion.
The encapsulant provided a protective barrier against the ingress of moisture and contaminants.
The encapsulant provided a stable platform for the delicate components to be mounted on.
The encapsulant provided electrical insulation and prevented short circuits.
The encapsulant served as a barrier against electromagnetic interference (EMI).
The encapsulant served as both a physical barrier and a thermal conductor.
The encapsulant surrounding the LED provided both physical protection and improved light distribution.
The encapsulant was applied in multiple layers to ensure complete coverage.
The encapsulant was applied using a robotic system to ensure accuracy and consistency.
The encapsulant was applied using a sophisticated dispensing system to ensure accuracy and consistency.
The encapsulant was applied using a vacuum process to eliminate air bubbles.
The encapsulant was chosen for its ability to withstand harsh environmental conditions.
The encapsulant was designed to be compatible with a wide range of electronic components.
The encapsulant was designed to be compatible with a wide range of substrates.
The encapsulant was designed to be easily removed for repair or replacement of components.
The encapsulant was designed to be easily reworkable for repair or replacement of components.
The encapsulant was designed to be environmentally friendly and non-toxic.
The encapsulant was designed to be resistant to UV radiation and other environmental factors.
The encapsulant was essential for protecting the fragile components from physical damage during transport.
The encapsulant was specifically formulated to resist the growth of mold and mildew.
The encapsulant was tested for its resistance to chemicals, solvents, and other corrosive substances.
The encapsulant was tested for its resistance to extreme temperatures and pressures.
The encapsulant's ability to withstand high voltages was tested rigorously.
The encapsulant's adhesion to the substrate was crucial for preventing delamination.
The encapsulant's color can be customized to match the aesthetics of the final product.
The encapsulant's high thermal conductivity helped to dissipate heat away from the sensitive components.
The encapsulant's low outgassing properties made it suitable for use in vacuum environments.
The encapsulant's low shrinkage properties helped to prevent stress cracking.
The encapsulant's mechanical strength was tested to ensure it could withstand vibrations and shocks.
The encapsulant's properties were carefully controlled to ensure optimal performance.
The encapsulant's properties were carefully tailored to match the thermal expansion coefficient of the integrated circuit.
The encapsulant's refractive index was optimized to enhance light extraction from the LED.
The encapsulant's resistance to chemicals was a critical factor in its selection for this application.
The encapsulant's transparency allowed for easy identification of components within the device.
The encapsulant's viscosity had to be precisely controlled to ensure uniform coverage.
The encapsulant’s ability to absorb vibrations and shocks was a key factor in its selection.
The encapsulant’s ability to dissipate heat was crucial for high-power devices.
The encapsulant’s color stability was a key requirement for aesthetic applications.
The encapsulant’s curing process required precise temperature and humidity control.
The encapsulant’s dielectric strength was a critical factor in high-voltage applications.
The encapsulant’s electrical properties were carefully controlled to ensure optimal performance.
The encapsulant’s flexibility allowed it to withstand mechanical stress.
The encapsulant’s formulation was carefully guarded as a trade secret.
The encapsulant’s long-term reliability was a key factor in its selection.
The encapsulant’s low viscosity allowed it to flow easily into tight spaces.
The encapsulant’s mechanical properties were tailored to meet the specific needs of the application.
The encapsulant’s performance was evaluated under a variety of stress conditions.
The encapsulant’s properties were optimized for use in high-frequency applications.
The encapsulant’s shelf life was carefully monitored to ensure its quality.
The engineers experimented with different methods for dispensing the encapsulant accurately.
The high-performance encapsulant protected the sensitive electronics from extreme humidity.
The innovative encapsulant enabled the creation of smaller, more powerful electronic devices.
The manufacturer claimed their encapsulant offered superior protection against corrosion.
The manufacturer tested various types of encapsulant to determine the optimal solution for their solar panels.
The material used as the encapsulant determined the operational temperature range of the device.
The new encapsulant formula reduced the overall weight and size of the electronic module.
The new encapsulant reduced the device's susceptibility to electrostatic discharge (ESD).
The new encapsulant was designed to minimize the impact of thermal expansion on the internal components.
The new self-healing encapsulant promised to significantly extend the lifespan of the device.
The research team focused on developing a more environmentally friendly encapsulant material.
The researcher explored the use of a novel bio-degradable encapsulant for sustainable packaging.
The researchers sought to improve the encapsulant’s long-term stability.
The robot precisely applied the encapsulant to the circuit board with minimal waste.
The selection process involved carefully considering the encapsulant’s thermal conductivity.
The team evaluated the encapsulant's resistance to extreme temperatures and pressures.
The thin-film solar cell relied on a durable encapsulant to maintain its efficiency over time.
The transparent encapsulant allowed technicians to visually inspect the internal wiring.
The type of encapsulant chosen depended on the specific application of the electronic component.
This specific encapsulant is formulated to provide exceptional electrical insulation.
Using the wrong encapsulant could void the warranty of the electronic component.